Bare Die SMT Distribution At ES Components
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Useful Industry Links Glossary Of Electronic and Elctrical Terms  

ES Components has collected hundreds of definitions to help you with the meaning of acronyms, words and
regulations that you may run into in the electronic and electrical industry
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  Term Definition  
       
  BARE DIE IIndividual, unpackaged silicon integrated circuits.  
       
  BALL GRID ARRAY (BGA) A packaging technology similar to a pad grid array, in which a device's external connections are arranged as an array of conducting pads on the base of the package. However, in the case of a ball grid array, small balls of solder are attached to the conducting pads.  
       
  BALL BONDING A thermocompression bonding technique. The wire end is melted to form a ball, which provides a larger area of contact than otherwise possible.  
       
  BALL GRID ARRAY (BGA) A packaging technology similar to a pad grid array. in which a device's external connections are arranged as an array of conducting pads on the base of the package. However, in the case of a ball grid array, small balls of solder are attached to the conducting pads.  
       
  BASE An electrical device consisting of one or more cells which converts chemical or solar energy into electrical energy. A battery provides a source of steady-state DC voltage.  
       
  BETA The Greek letter that designates the current gain of a bipolar transistor. It is the ratio of the transistor's output current (IC) to its input current (IB).  
       
  BIAS VOLTAGE The DC voltage applied across the terminals of a PN junction , whether the device is a diode, bipolar transistor, or JFET. A PN junction is forward biased when a positive voltage is applied to the P-region with respect to the N-region, and reversed biased when the voltage polarity is reversed.  
       
  BIPOLAR TRANSISTOR A three-terminal semiconductor component with a three-layer structure of alternate negative and positive type materials (NPN or PNP). It provides current gain and voltage amplification in a circuit.  
       
  BLOW TIME The maximum time required for a fuse to open after being subjected to an excess of the device's rated current. Fuses are classified by blow time as slow, normal, or fast  
       
  BONDING, DIE Attaching of a semiconductor die to the package or substrate.  Also called die attachment.  
       
  BONDING WIRE Fine wire used for making electrical interconnection between various bonding pads to device terminal.  
       
  BRIDGE RECTIFIER Four semiconductor diodes configured as a bridge that acts to change AC to full-wave pulsating D  
       
  BULK METAL FOIL A foil layer of resistance alloy bonded to a ceramic substrate providing a compensation technique to produce a very low TCR and insulated by a transfer molded case.  
       
       
       
       
       
       
       


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