Bare Die SMT Distribution At ES Components
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Useful Industry Links Glossary Of Electronic and Elctrical Terms  

ES Components has collected hundreds of definitions to help you with the meaning of acronyms, words and
regulations that you may run into in the electronic and electrical industry
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  Term Definition  
   
  WAFER A disk of semiconductor material that forms the base on which a number of integrated circuits are built.  Typical 4, 6, 8, or 12 inches in diameter and between
.010 & .030 thick
 
       
  WATT The unit of measurement for electrical power, named after James Watt, an 18th century Scottish engineer. One watt of power is dissipated when a voltage of one volt is applied across a load of one ohm resulting in one ampere of current in the circuit. See POWER.  
       
  WAVELENGTH The physical distance between the beginning and the end of a cycle in a periodic wave (sine wave or square wave) as it travels through space or through a conductor. Wavelength is measured in meters (or in Ångstrom units) and is designated with the Greek letter lambda (l).  
       
  WIRE BOND The use of tiny wires that are soldered to the bare die on one end
and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip.
 
       


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