Design Engineers! When Precision Is Critical…
Posted on April 1, 2015 | By Rick Grigalunas | Leave a response
Get The Best Ultra Precision Bulk Metal® Foil Resistors There is No Alternative! Why? One. The industry’s lowest temperature coefficient of resistance (TCR), and power coefficient (PCR). Two. Bulk Metal foil resistors deliver proven reliability and stable performance. (Even when exposed to unstable levels of temperature and humidity or other harsh […]
Having Fun With…Big Questions!
Posted on March 27, 2015 | By Rick Grigalunas | Leave a response
Questions Never Stop! Enjoy! Why Does Your Sandwich Come With a Pickle? Who Actually Invented The Wheel? Can Too Much Spicy Food Burn Off Your Taste Buds? What Legal Authority Does Judge Judy Have? How Many Germs Are in a Kiss? Is a Moonroof Different Than a Sunroof? Does Cracking Your Knuckles Really Give […]
Design Engineers! 8 Benefits Of Die Stacking
Posted on March 27, 2015 | By Rick Grigalunas | Leave a response
Design Engineers! 8 Benefits Of Die Stacking Definition In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and […]
Tell Me… Just What Is A Hybrid Integrated Circuit?
Posted on March 26, 2015 | By Rick Grigalunas | Leave a response
Tell Me…Just What Is A Hybrid Integrated Circuit? A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, and capacitors), bonded to a substrate or printed circuit board (PCB). Hybrid […]
Tell Me! Using Bare Die Improves What?
Posted on March 25, 2015 | By Rick Grigalunas | Leave a response
Tell Me! Using Bare Die Improves What? Electrical Performance Size & Weight Integration Reliability Designers of space-constrained systems face the challenge of determining how to incorporate expanding functional needs into reduced spaces in a timely and cost-effective manner. For many handheld, portable, and other small form factor products, silicon packaging has become the […]
Engineers On-The-Go…Go With These Apps!
Posted on March 24, 2015 | By Rick Grigalunas | Leave a response
Engineers On-The-Go… Go With These Apps! The App Store now holds 1 million apps—so does Google. We all now have more choices than ever with endless low-cost digital pearls just waiting to be downloaded. How does anybody find the best? I guess you have to sift through user and journalist reviews, check the umber of […]
Design Engineers! 1 More Reason To Use Bare Die.
Posted on March 19, 2015 | By Rick Grigalunas | Leave a response
Design Engineers! 1 More Reason To Use Bare Die Miniaturization Unpackaged Die In Embedded Designs Have Benefits. Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontroller (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows […]
Design Engineers! Why Use Current Sensing & Shunt Resistors?
Posted on March 13, 2015 | By Rick Grigalunas | Leave a response
Design Engineers! Why Use Current Sensing & Shunt Resistors? One Reason. To Know the amount of current being delivered to a load. Here’s Why? In low-power consumer products the supply current can be monitored to understand the system’s impact on battery life. The load current also can be used to make safety-critical decisions in […]
Tell Me. What Is Die Bonding? – The Pros & Cons
Posted on March 13, 2015 | By Rick Grigalunas | Leave a response
What is die bonding? Die bonding (often referred to as die attach) is the process of attaching a die/chip to a substrate or package. Die attach is accomplished by using one of the following processes: Eutectic Solder Adhesive Glass or Silver-Glass For our purposes here we will focus on Eutectic, Adhesive and Silver-Glass. […]
Remember? … The 7 Benefits Of Using Micrel LDO Regulators & MOSFET Drivers?
Posted on March 11, 2015 | By Rick Grigalunas | Leave a response
Remember? … The 7 Benefits Of Using Micrel LDO Regulators & MOSFET Drivers? Right to the point. Sometimes we forget the very straightforward and simple reasons why we chose to use something in the past. Here’s a reminder why you chose to use Micrel’s LDO Regulators & MOSFET Drivers for your applications in the past. The 7 […]
