Archive | Know Our Components

Design Engineers! When Precision Is Critical…

 Get The Best Ultra Precision Bulk Metal® Foil Resistors There is No Alternative!     Why?   One. The industry’s lowest temperature coefficient of resistance (TCR), and power coefficient (PCR).   Two. Bulk Metal foil resistors deliver proven reliability and stable performance. (Even when exposed to unstable levels of temperature and humidity or other harsh […]

Design Engineers! 8 Benefits Of Die Stacking

Design Engineers! 8 Benefits Of Die Stacking       Definition In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and […]

Tell Me… Just What Is A Hybrid Integrated Circuit?

   Tell Me…Just What Is A Hybrid Integrated Circuit?   A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, and capacitors), bonded to a substrate or printed circuit board (PCB). Hybrid […]

Design Engineers! 1 More Reason To Use Bare Die.

Design Engineers! 1 More Reason To Use Bare Die Miniaturization Unpackaged Die In Embedded Designs Have Benefits. Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontroller (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows […]

Ever Wonder…?

Ever Wonder…? Why Are Silicon Wafers Round, Instead Of Rectangular?   Why are silicon wafers, used in chip production, round instead of squared or rectangular? The reasoning being, since the die pieces that are being cut out of the wafer are square, isn’t there waste at the edges? Couldn’t this be avoided with squared/rectangular wafers? […]

Design Engineers! 5 Benefits Of Using Bare Die

Design Engineers! 5 Benefits Of Using Bare Die One. Smaller size Using bare die can allow for reduced board space. Two. Operating Temperature Package thermal characteristics no longer inhibit the performance of the die or the environments where they can operate Three. Ruggedness Direct die attach and wirebond provides your design with additional protections against […]

Bare Die / Package Strategies

Bare Die / Package Strategies Integrating a chip into an electronic product or system requires an electrical subsystem between the chip and the system. Two main approaches have emerged: individual packaging and bare die techniques.   Bare Die Techniques There are two principal bare die techniques: wire bonding and bump/flip-chip. (Fig.36) The wire bonding technique […]

Quick – Tell Me How To Handle Bare Die

Quick – Tell Me How To Handle Bare Die   Handling Bare Die can be tricky.The following should help raise the sensitivity and awareness of special physical effects which could harm the quality and yield of the production of bare die.           Bare Die Is Delivered In Different Forms   Sensitivity […]

Quick, Tell Me – What Is Wafer Dicing?

Quick, Tell Me – What Is Wafer Dicing?   Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. […]

All The Bare DIe and Surface Mount Components You Need.

Hello everyone, I hope that work is going well and trust that you are taking some time to enjoy the winter? I just wanted to let you know that I have been actively using LinkedIn recently for our company, ES Components and found it to be an incredibly powerful networking tool…especially when we use it […]