Tag Archives | Bare Die

Tell Me! Using Bare Die Improves What?

Posted on March 25, 2015 | By Rick Grigalunas | Leave a response

Tell Me! Using Bare Die Improves What?   Electrical Performance Size & Weight Integration Reliability   Designers of space-constrained systems face the challenge of determining how to incorporate expanding functional needs into reduced spaces in a timely and cost-effective manner. For many handheld, portable, and other small form factor products, silicon packaging has become the […]

Design Engineers! 1 More Reason To Use Bare Die.

Posted on March 19, 2015 | By Rick Grigalunas | Leave a response

Design Engineers! 1 More Reason To Use Bare Die Miniaturization Unpackaged Die In Embedded Designs Have Benefits. Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontroller (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows […]

6 Tips To Improve Chip on Board Assembly

Posted on March 6, 2015 | By Rick Grigalunas | Leave a response

6 Tips To Improve Chip on Board Assembly One.  Before attaching the bare die to PCB, burnish the wire bond pads with a soft wire brush. Cleaning will help to eliminate oxidation build up (Figure 5-1). Two. Use a vacuum tool tip to die attach the bare die, as it is critical to protect the […]

Design Engineers! 5 Benefits Of Using Bare Die

Posted on March 2, 2015 | By Rick Grigalunas | Leave a response

Design Engineers! 5 Benefits Of Using Bare Die One. Smaller size Using bare die can allow for reduced board space. Two. Operating Temperature Package thermal characteristics no longer inhibit the performance of the die or the environments where they can operate Three. Ruggedness Direct die attach and wirebond provides your design with additional protections against […]

Bare Die / Package Strategies

Posted on February 27, 2015 | By Rick Grigalunas | Leave a response

Bare Die / Package Strategies Integrating a chip into an electronic product or system requires an electrical subsystem between the chip and the system. Two main approaches have emerged: individual packaging and bare die techniques.   Bare Die Techniques There are two principal bare die techniques: wire bonding and bump/flip-chip. (Fig.36) The wire bonding technique […]

Quick – Tell Me How To Handle Bare Die

Posted on February 25, 2015 | By Rick Grigalunas | Leave a response

Quick – Tell Me How To Handle Bare Die   Handling Bare Die can be tricky.The following should help raise the sensitivity and awareness of special physical effects which could harm the quality and yield of the production of bare die.           Bare Die Is Delivered In Different Forms   Sensitivity […]

All The Bare DIe and Surface Mount Components You Need.

Posted on February 12, 2015 | By Rick Grigalunas | Leave a response

Hello everyone, I hope that work is going well and trust that you are taking some time to enjoy the winter? I just wanted to let you know that I have been actively using LinkedIn recently for our company, ES Components and found it to be an incredibly powerful networking tool…especially when we use it […]

Tell Me – What Is A Clean Room?

Posted on January 26, 2015 | By Rick Grigalunas | Leave a response

   Tell Me – What Is A Clean Room? A cleanroom or clean room is an environment, typically used in manufacturing or scientific research, with a low level of environmental pollutants such as dust, airborne microbes, aerosol particles, and chemical vapors. More accurately, a cleanroom has a controlled level of contamination that is specified by […]

One Stop Shopping…It Can Work!

Posted on January 13, 2015 | By Rick Grigalunas | Leave a response

One Stop Shopping…It Can Work!   Shopping for a Franchised Distributor of Bare Die & SMT Components? Where do I start? What do I do? What’s Bare Die? What’s a SMT Component? For procurement decision makers, selecting which distributor you use can impact your company’s bottom line…and your career. Your electronics distributor plays an important […]

The Shrinking World Of Electronics

Posted on December 18, 2014 | By Rick Grigalunas | Leave a response

Bare Die Used In Miniature Circuit Assemblies   The size of your thumb are roughly the dimensions to which electronic medical devices are shrinking. They are necessary to be easily implanted into people who are suffering from such life-altering disorders as chronic pain,  and limb dysfunction. The new world of tomorrow is here! Such devices require […]