Tag Archives | Die

Quick, Tell Me – What Is Wafer Dicing?

Quick, Tell Me – What Is Wafer Dicing?   Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. […]

The Shrinking World Of Electronics

Bare Die Used In Miniature Circuit Assemblies   The size of your thumb are roughly the dimensions to which electronic medical devices are shrinking. They are necessary to be easily implanted into people who are suffering from such life-altering disorders as chronic pain,  and limb dysfunction. The new world of tomorrow is here! Such devices require […]

The Secret of Specifying and Obtaining the Correct Bare Die to Build Hybrid Microcircuits

Article By: Curt Olsen Director of Sales ES Components Specifying and obtaining the correct bare die to build hybrid microcircuits and multi-chip modules presents some specific problems. Dominant design factors here are hermeticity, size, and weight. However, the special needs related to the supply of bare die continues to mystify much of the electronics community […]