Tag Archives | Die Stacking
Design Engineers! 8 Benefits Of Die Stacking
Posted on March 27, 2015 | By Rick Grigalunas | Leave a response
Design Engineers! 8 Benefits Of Die Stacking Definition In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and […]
