Tag Archives | Die Stacking

Design Engineers! 8 Benefits Of Die Stacking

Design Engineers! 8 Benefits Of Die Stacking       Definition In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and […]