Tag Archives | Laser Cutting
Quick, Tell Me – What Is Wafer Dicing?
Posted on February 20, 2015 | By Rick Grigalunas | Leave a response
Quick, Tell Me – What Is Wafer Dicing? Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. […]
