Tag Archives | Miniaturization

Design Engineers! 1 More Reason To Use Bare Die.

Posted on March 19, 2015 | By Rick Grigalunas | Leave a response

Design Engineers! 1 More Reason To Use Bare Die Miniaturization Unpackaged Die In Embedded Designs Have Benefits. Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontroller (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows […]

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The Shrinking World Of Electronics

Posted on December 18, 2014 | By Rick Grigalunas | Leave a response

Bare Die Used In Miniature Circuit Assemblies   The size of your thumb are roughly the dimensions to which electronic medical devices are shrinking. They are necessary to be easily implanted into people who are suffering from such life-altering disorders as chronic pain,  and limb dysfunction. The new world of tomorrow is here! Such devices require […]

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