Tag Archives | Multi-Chip Modules
Design Engineers! 1 More Reason To Use Bare Die.
Posted on March 19, 2015 | By Rick Grigalunas | Leave a response
Design Engineers! 1 More Reason To Use Bare Die Miniaturization Unpackaged Die In Embedded Designs Have Benefits. Embedded system designers have benefitted from procuring integrated circuits (ICs) such as microcontroller (MCUs) in die form for many years. Because the dimensions of die are much smaller than when the IC is packaged, the use of unpackaged die allows […]
