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Die Products (View References) |
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Introduction To Die Products
Unpackaged die allow designers to
overcome the challenges of small
form factor applications. View |
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Known Good Die
Known-Good-Die (KGD) processing
allows for better yields and improved
short-term reliability. View |
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Known Good Die Myths
Four myths about
Known-Good-Die (KGD). View |
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Die Case Studies
Innovative uses of die products in
four different applications. View |
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Die Assembly Processes |
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System-In-Package Assembly
Combining all of the electronic
components. View |
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Wafer Thinning View |
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Die Attach View |
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Wire Bond View |
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Assembly Process View |
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Module Testing View |
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Flip-Chip Assembly
Offers optimized electrical
performance
in addition to
optimized miniaturization. View |
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Solder Flip Chip View |
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Underfill Encapsulation View |
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Adhesive Flip Chip View |
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Wafer Level Packaging View |
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Process Flow View |
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Process Considerations View |
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Chip-On-Board (COB) Assembly
Provides the capability to perform direct
chip to chip wiring that facilitates improved
performance and strong functional
integration in many modern high speed
applications. View |
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Process View |
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PCB Preparation View |
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Die Attach View |
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Encapsulation View |
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More Encapsulation View |
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Challenges In Bare Die Mounting
Challenges In Bare Die Mounting
(Larry Gilg Die Products
Consortium Austin,Texas) View |
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Quality & Reliability |
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Guidelines For Handling Die
General Guidelines For Handling Die View |
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Visual Inspection Criteria
Visual criteria for the inspection
of unpackaged die and wafers. View |
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Contamination View |
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Cracks View |
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Bridging & Shorting View |
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Glassification View |
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Scratches View |
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Delamination View |
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Assembly Workmanship Criteria
Criteria covering die placement, encapsulation,
spacing, wirebond, and rebonding. View |
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Encapsulation View |
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Spacing View |
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Wirebond View |
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Rebonding View |
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Chip On Board (COB) Reliability
Life test, evaluation systems, process
flow design issues. View |
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General Guidelines |
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Storage, Handling, & Shipping of Die Products
Safe handling guidelines for packaged ICs
that are practiced in the Surface Mount
Technology (SMT) assembly industry,
and to provide information to purchasers
of wafer and die products. View |
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Handling View |
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Shipping Materials View |
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Shipping Technologies View |
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Mounting & Dicing View |
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Bare Die Product Standards
An overview of Bare Die standards View |
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Developing New Standards View |
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Existing Standards View |
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Articles
Useful articles relating to Bare Die technologies. |
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Burn-In Effectiveness --
Theory & Measurement View |
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Defect Level As A Function
Of Fault Coverage View |
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Die Products Ideal IC Packaging
For Demanding Applications View |
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